UV RESIN
GEL POLISH
The UV resin for gel nail polish utilizes light-curing technology to eliminate traditional solvent evaporation, enabling rapid film formation with vibrant colors. It balances health safety and low-carbon efficiency, pioneering a new trend in sustainable development for the nail industry.
ADHESIVE
The UV adhesive employs ultraviolet (UV) curing technology, eliminating the need for heating or solvents, significantly reducing energy consumption and carbon emissions. Its curing process releases no volatile organic compounds (VOCs), offering an environmentally friendly solution with high bonding strength.
3D PRINTING
The 3D printing UV resin cures through ultraviolet (UV) light exposure without requiring high-temperature baking, significantly reducing energy consumption. Its curing process releases no solvents or toxic gases, delivering high printing precision with recyclable waste materials.
UV INK
UV inks utilize ultraviolet (UV) curing technology that eliminates solvent evaporation, achieving near-zero VOC emissions. Their energy-efficient curing process delivers superior film performance while minimizing pollution at the source, aligning with green printing and carbon-neutral sustainability goals.
FUNCTIONAL COATINGS
Functional coating UV resins cure via ultraviolet light without solvents or high-temperature baking, delivering exceptional weather resistance, corrosion protection, and energy efficiency. They minimize VOC emissions while enabling high-performance, eco-friendly protective coatings for sustainable industrial applications.
VACUUM PLATING
Vacuum coating UV resin relies on ultraviolet (UV) curing technology, breaking free from the dependence on high-temperature baking and organic solvents in traditional processes. The curing process requires no high-temperature environment, avoiding high energy consumption issues. The resulting coating layer offers high glossiness, strong adhesion, and excellent wear resistance, meeting both the decorative and functional requirements of vacuum coating.




